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DISCOVER NOW: The first server CPU with true 3D die stacking and the World’s Fastest HPC & AI Accelerator

March 24, 2022

AMD, EPYC, SERVER, Instinct, GPU, HPC, AI, MI200

DISCOVER NOW: The first server CPU with true 3D die stacking and the World’s Fastest HPC & AI Accelerator

AMD EPYC™ processors with AMD 3D V-Cache™ technology & AMD Instinct™ MI200 Series

Nothing Stacks Up To EPYC™

New 3rd Gen AMD EPYC™ Processors with AMD 3D V-Cache™ technology are raising the bar once more for breakthrough performance on targeted technical computing workloads like Electronic Design Automation (EDA), Computational Fluid Dynamics (CFD), and Finite Element Analysis (FEA) software and solutions, helping optimize performance to accelerate the development of new products and technologies. Delivering breakthrough performance per core and helping lower TCO while accelerating product development. Socket compatible with existing 3rd Gen AMD EPYC platforms, these new processors with AMD 3D V-Cache work with existing software solutions to get up and running quickly, to help drive better, energy-efficient business outcomes with the confidence of modern security. 

Whether in the cloud or on-premise, AMD EPYC™ 7003 Processors have reached new heights with performance and efficiency, yet the everincreasing need for more complex simulations and rapid design demand even more. The new AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology accelerates technical computing workloads like EDA and CFD with the leading-edge innovation AMD 3D V-Cache, providing up to 3X the L3 cache (768MB) than standard EPYC 7003 processors to process the massive quantities of data necessary to stay ahead of your compute demands while using your existing simulation software solutions. Your technical workloads just perform better, with an EPYC 7373X powered server able to perform up to 66% more EDA RTL simulation jobs a day than an EPYC 73F3 powered server with the same number of cores.  

Dan McNamara, SVP and GM Server Business Unit, introduces AMD EPYC™ processors with AMD 3D V-Cache™ technology.

AMD INSTINCT™ MI200 Series Accelerator

World’s Fastest HPC and AI Accelerator
The era of exascale is here. Immense computational power coupled withthe fusion of HPC and AI is enabling researchers and scientists to tackleour most pressing challenges from climate change to vaccine research.With the AMD Instinct™ MI200 accelerators and ROCm™ 5.0 softwareecosystem, innovators can tap the power of the world’s most powerful HPC and AI data center GPUs to accelerate their time to scienceand discovery.Based on the 2nd Gen AMD CDNA™ architecture, AMD Instinct™ MI200accelerators deliver a quantum leap in HPC and AI performance overcompetitive data center GPUs today. With an up to 4x advantage in HPCperformance compared to competitive GPUs, the MI200 accelerator is thefirst data center GPU to deliver 383 teraflops of theoretical mixedprecision FP16 performance for deep learning training, offering users apowerful platform to fuel the convergence of HPC and AI.

Innovations Delivering Performance Leadership
AMD innovations in architecture, packaging and integration are pushing the boundaries of computing by unifying the most importantprocessors in the data center, the CPU and the GPU accelerator. With industry-first multi-chip GPU modules along with 3rd Gen AMD Infinity Architecture, AMD is delivering performance, efficiency and overall system throughput for HPC and AI using AMD EPYC™ CPUs and AMD Instinct™ MI200 series accelerators.

Contact your ASBIS Manager to get more details.


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